Title:
COIL DEVICE
Document Type and Number:
Japanese Patent JP2018006674
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a coil device which unfailingly achieves desired performance.SOLUTION: A coil device 1 includes: a coil 4; and a composite potting part 6 which seals the coil 4. The composite potting part 6 includes a first potting part 11 and a second potting part 12. Heat conductivity of a filler forming the first potting part 11 is higher than heat conductivity of a filler forming the second potting part 12.SELECTED DRAWING: Figure 1
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Inventors:
UEDA AKIO
ARAKI ATSUSHI
ARAKI ATSUSHI
Application Number:
JP2016135209A
Publication Date:
January 11, 2018
Filing Date:
July 07, 2016
Export Citation:
Assignee:
IHI CORP
International Classes:
H01F38/14; H01F5/00; H01F27/02; H01F27/08; H02J50/10
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Ryosuke Yasuda
Hideki Komatsu
Yoshiki Kuroki
Ryosuke Yasuda
Hideki Komatsu
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