Title:
コイル装置
Document Type and Number:
Japanese Patent JP7095594
Kind Code:
B2
Abstract:
To provide a coil device capable of compaction and low profile by preventing a wire from floating.SOLUTION: A first passage 210 and a second passage 220 are placed to intersect at a predetermined angle in the terminal installation part 24b of a second core guide 23, and an inclined wall 230a having an inclined plane 233a, the height of which decreases from the gradient starting position 232a in the direction of the connection part 281b of a terminal 28b, is formed at a corner on the outside of a direction change part 240. A lead part 38b led out from a coil 30 is guided along the inclined plane 233a of the inclined wall 230a, and pulled down to the bottom faces 211, 221 of the first and second passages 210, 220 and placed. With such an arrangement, floating of a wire (lead) is prevented appropriately, thus enabling compaction and low profile.SELECTED DRAWING: Figure 3
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Inventors:
Shinji Higa
Kumagai Masaru
Kumagai Masaru
Application Number:
JP2018248149A
Publication Date:
July 05, 2022
Filing Date:
December 28, 2018
Export Citation:
Assignee:
tdk Corporation
International Classes:
H01F5/02; H01F27/28; H01F27/29
Domestic Patent References:
| JP2016139744A | ||||
| JP2017212355A | ||||
| JP59045906U | ||||
| JP2018107244A | ||||
| JP4038016U | ||||
| JP48000049U |
Attorney, Agent or Firm:
Maeda/Suzuki International Patent Corporation