Title:
コイル電子部品
Document Type and Number:
Japanese Patent JP6569916
Kind Code:
B2
Abstract:
A coil electronic component includes a first coil and a second coil disposed on and beneath a main board, respectively, wherein the first coil includes a first coil pattern and a second coil pattern connected to each other through a first via of a first insulating layer and disposed on and beneath the first insulating layer, respectively, and the second coil includes a third coil pattern and a fourth coil pattern connected to each other through a second via of a second insulating layer and disposed on and beneath the second insulating layer, respectively. In this case, the main board, the first insulating layer, and the second insulating layer include through-holes formed in central portions thereof, respectively.
Inventors:
Yun, Chang
Lee, Don Juan
Ann, Youn Kyu
Lee, Don Juan
Ann, Youn Kyu
Application Number:
JP2017220141A
Publication Date:
September 04, 2019
Filing Date:
November 15, 2017
Export Citation:
Assignee:
Samsung Electro-Mechanics Co., Ltd.
International Classes:
H01F27/00; H01F17/00; H01F17/04
Domestic Patent References:
| JP2007067214A | ||||
| JP2008166625A | ||||
| JP2015076603A | ||||
| JP11054336A | ||||
| JP2013201375A | ||||
| JP2017034227A | ||||
| JP5050708U |
Attorney, Agent or Firm:
Longhua International Patent Service Corporation