Title:
コイル対、送電装置及び受電装置並びに電力伝送システム
Document Type and Number:
Japanese Patent JP7167677
Kind Code:
B2
Abstract:
To provide a coil capable of improving the flexibility of coil layout and the use efficiency of a winding wire material by leveling a current density in a coil used for a non-contact type power transmission system and capable of suppressing heating of the coil.SOLUTION: A coil CL1, used for power transmission or power reception in non-contact type power transmission and formed from winding wire wound in a concentric way, is formed so that a cross section of any other copper thin film wire of the coil CL1 than a copper thin film wire laminated at a position facing a copper thin film wire constituting a laminated coil CL2 is larger than that of a copper thin film wire laminated at the facing position.SELECTED DRAWING: Figure 7
Inventors:
Masato Okabe
Application Number:
JP2018229773A
Publication Date:
November 09, 2022
Filing Date:
December 07, 2018
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
H01F38/14; H01F5/00; H02J50/10
Domestic Patent References:
| JP2011200045A | ||||
| JP566936U | ||||
| JP201595656A |
Foreign References:
| WO2011125328A1 |
Attorney, Agent or Firm:
Patent Business Corporation Intect International Patent Office
Oku Wako
Oku Wako
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