Title:
コイル部品およびコイル部品の製造方法
Document Type and Number:
Japanese Patent JP7014859
Kind Code:
B2
Abstract:
A coil component includes a support substrate, a coil portion including a first conductive layer being in contact with one surface of the support substrate, and a second conductive layer disposed on the first conductive layer to be spaced apart from the one surface of the support substrate, and a body including the support substrate and the coil portion embedded in the body. One side of the first conductive layer is closer to a center of the second conductive layer in a width direction of the coil portion than one side of the second conductive layer.
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Inventors:
Hul, Young Min
Han, Dong Ho
Kim, Boum Theok
Han, Dong Ho
Kim, Boum Theok
Application Number:
JP2020095253A
Publication Date:
February 01, 2022
Filing Date:
June 01, 2020
Export Citation:
Assignee:
Samsung Electro-Mechanics Company Limited.
International Classes:
H01F17/00; H01F5/00; H01F27/28; H01F41/04
Domestic Patent References:
| JP2006310716A | ||||
| JP9153406A | ||||
| JP9270329A | ||||
| JP2017092444A | ||||
| JP2001203109A |
Foreign References:
| KR1020170123300A |
Attorney, Agent or Firm:
Longhua International Patent Service Corporation