Title:
低温硬化組成物
Document Type and Number:
Japanese Patent JP2011530618
Kind Code:
A
Abstract:
The present invention relates to thermosetting resin compositions that include maleimide-, nadimide- or itaconimide-containing compounds and a metal/carboxylate complex and a peroxide, which is curable at a low temperature at relative short period of time, such as less than about 100° C., for instance 55-70° C., over a period of time of about 30 to 90 minutes. The invention further provides methods of preparing such compositions, methods of applying such compositions to substrate surfaces, and packages and assemblies prepared therewith for connecting microelectronic circuitry.
Inventors:
Bye, Jie
Gupta, Shashik.
Gupta, Shashik.
Application Number:
JP2011522072A
Publication Date:
December 22, 2011
Filing Date:
August 10, 2009
Export Citation:
Assignee:
HENKEL CORPORATION
International Classes:
C08F22/40; C08F2/44; C08F4/40; C09J4/00; C09J9/02; C09J11/04; C09J183/08; C09J183/10; H01L21/52; H01L23/29; H01L23/31
Domestic Patent References:
| JPH06100633A | 1994-04-12 | |||
| JP2005519150A | 2005-06-30 | |||
| JP2001501230A | 2001-01-30 |
Attorney, Agent or Firm:
Katsuhiro Ito
Akiko Ono
Akiko Ono