Title:
COLLET FOR DIE BONDING
Document Type and Number:
Japanese Patent JPH06151482
Kind Code:
A
Abstract:
PURPOSE: To provide a collet for die bonding which can be prevented from being damaged, can prevent the adverse influence of silicon waste produced from semiconductor pellets, and can make the maintenance and management of a die bonding device easier.
CONSTITUTION: In the title collet 10 which continuously joins square semiconductor pellets to lead frames by repeating attraction of pellets by suction by means of a pyramid-like recessed section 8 and pressing of the attracted pellets against the upper surface of the lead frame, escape holes 9c having circular cross sections are formed through the ridges 8a of the section 8 with which the four corners of the pellets come into contact for housing the corner sections of the pellets.
Inventors:
TAKAHASHI HIDEYUKI
SHIODA TAKESHI
SHIODA TAKESHI
Application Number:
JP29609492A
Publication Date:
May 31, 1994
Filing Date:
November 05, 1992
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
B25J15/06; H01L21/52; H01L21/677; H01L21/68; (IPC1-7): H01L21/52; B25J15/06; H01L21/68
Attorney, Agent or Firm:
Hisano Hatano (1 person outside)
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