To prevent generation of wrinkles and cracks in a color layer, protective film and transparent conductive film by specifying the production conditions in such a manner that the stress generating in the transparent conductive film calculated from the radii of curvature of a silicon wafer before and after the film is formed is compressive and a specified value or lower than that.
In the process of forming a transparent conductive film on a color filter, the film forming conditions are specified in such a manner that when the transparent conductive film is to be formed on a silicon wafer, the stress generating in the transparent conductive film calculated from the radii of curvature of the silicon wafer before and after the film is formed is compressive and ≤600 MPa. In other words, in the process of assembling a cell for the production of a liquid crystal device, the color filter is cleaned with warm pure water or the like to clean off dust or the like depositing on the color filter. In the cleaning process, if the compressive stress generating in the transparent conductive film is large, wrinkles or cracks easily generate, and if the stress is small, wrinkles or cracks hardly generate. Especially in the region of ≤600 MPa compressive stress, wrinkles and cracks hardly generate in the cleaning process.
OKADA TAKESHI