Title:
COLORED SOLDERING MATERIAL AND METHOD FOR FORMING COLORED FILM ON SOLDERED PART
Document Type and Number:
Japanese Patent JP2622531
Kind Code:
B2
Abstract:
PURPOSE: To obtain a colored soldering material and a method for forming colored film on a soldered part which facilitate a visual inspection on a soldered part in the manufacturing field of electronic instrument.
CONSTITUTION: Such colored powder compound is mixed in a flux that is lighter than the base material for solder in the specific gravity, that is provided with an undecomposable property even under the high temperature of solder melting point or above and that is physically and chemically stable; and, after soldering is performed by using a cream solder containing this flux, the colored powder is precipitated on the surface of the soldered part to form a colored film.
Inventors:
Kazuchika Ota
Tsuyoshi Komatsu
Tsuyoshi Komatsu
Application Number:
JP14413494A
Publication Date:
June 18, 1997
Filing Date:
June 03, 1994
Export Citation:
Assignee:
Eastern Co., Ltd.
Kazuchika Ota
Utsunomiya Tadashi
Kazuchika Ota
Utsunomiya Tadashi
International Classes:
B23K1/00; B23K31/12; B23K35/02; B23K35/14; B23K35/363; B23K35/26; H05K3/34; H05K1/02; (IPC1-7): B23K35/363; B23K1/00; B23K35/14; H05K3/34
Domestic Patent References:
| JP61115692A | ||||
| JP740078A | ||||
| JP525013B2 |
Attorney, Agent or Firm:
Keiji Matsuura
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