Title:
組合せレーザおよび荷電粒子ビーム・システム
Document Type and Number:
Japanese Patent JP5756585
Kind Code:
B2
Abstract:
A combined laser and charged particle beam system. A pulsed laser enables milling of a sample at material removal rates several orders of magnitude larger than possible for a focused ion beam. In some embodiments, a scanning electron microscope enables high resolution imaging of the sample during laser processing. In some embodiments, a focused ion beam enables more precise milling of the sample. A method and structure for deactivating the imaging detectors during laser milling enables the removal of imaging artifacts arising from saturation of the detector due to a plasma plume generated by the laser beam. In some embodiments, two types of detectors are employed: type-1 detectors provide high gain imaging during scanning of the sample with an electron or ion beam, while type-2 detectors enable lower gain imaging and endpoint detection during laser milling.
Inventors:
Marcus Straw
Mark Wutroth
N William Parker
Mark Wutroth
N William Parker
Application Number:
JP2013503967A
Publication Date:
July 29, 2015
Filing Date:
April 07, 2011
Export Citation:
Assignee:
F-I-I Company
International Classes:
B23K15/00; H01J37/317; B23K26/00; B23K26/12; B23K26/36; H01J37/244
Domestic Patent References:
| JP6260130A | ||||
| JP2001345360A | ||||
| JP11154479A |
Foreign References:
| WO2010006188A2 |
Attorney, Agent or Firm:
Masahiko Amagai