COMMUNICATION MODULE, AND ELECTRONIC APPARATUS

Title:

COMMUNICATION MODULE, AND ELECTRONIC APPARATUS

Document Type and Number:

Japanese Patent JP2009239675

Kind Code:

A

Abstract:

To miniaturize a communication module capable of controlling antenna directivity.

A communication module 21 includes a silicon wafer 23 as a substrate, a planar antenna 24, and a shaft member 25 as a supporting means. The communication module 21 further includes a case 26 covering the silicon wafer 23, the planar antenna 24 and the shaft member 25, a plurality of external connecting terminals 27 provided on an outer side face of a bottom of the case 26, and a module substrate 28 for placing the case 26 thereon via the external connecting terminals 27. The planar antenna 24 is a receiving device formed with MEMS and has directivity with a direction perpendicular to a plane as an orientation direction. The shaft member 25 is provided on the silicon wafer 23, supports the planar antenna 24 while varying an angle of the plane of the planar antenna 24 with respect to a surface of the silicon wafer 23 (a bottom face of a recess 31) and electrically connects the silicon wafer 23 and the planar antenna 24.

Inventors:

TAKIZAWA MINORU
NINOMIYA RYOJI

Application Number:

JP2008083849A

Publication Date:

October 15, 2009

Filing Date:

March 27, 2008

Export Citation:

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Assignee:

TOSHIBA CORP

International Classes:

H01Q3/04; H04B7/10

Domestic Patent References:

JP2007266818A	2007-10-11
JP2001292026A	2001-10-19

Foreign References:

WO2002015327A1

2002-02-21

Attorney, Agent or Firm:

Hisashi Hatano
Shunguchi Sekiguchi
Akio Saruwatari
Osamu Kawamura
Takehiko Yamada

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