Title:
【発明の名称】柔軟性ワイヤからの電気的接触構造
Document Type and Number:
Japanese Patent JP3114999
Kind Code:
B2
Abstract:
The probe card assembly (500) includes a probe card (502), and a space transformer (506) having resilient contact structures (524) mounted to and extending from terminals (522) on its surface. An interposer (504) is disposed between the space transformer and the probe card. The space transformer and interposer are stacked on the probe card and the resilient contact structures can be arranged to optimise probing of entire wafer.
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Inventors:
Handross, igo, wai
Matthew, Gaetan, El
Eldridge, Benjamin, N
Groove, Gary, W
Matthew, Gaetan, El
Eldridge, Benjamin, N
Groove, Gary, W
Application Number:
JP51884496A
Publication Date:
December 04, 2000
Filing Date:
November 13, 1995
Export Citation:
Assignee:
Form Factor, Incorporated
International Classes:
G01R1/073; B23K1/00; B23K20/00; B23K31/02; C23C18/16; C25D5/16; C25D7/12; G01R1/04; G01R1/06; G01R1/067; G01R31/26; G01R31/28; H01L21/00; H01L21/48; H01L21/56; H01L21/58; H01L21/60; H01L21/603; H01L21/607; H01L21/66; H01L21/68; H01L23/02; H01L23/12; H01L23/32; H01L23/48; H01L23/485; H01L23/49; H01L23/498; H01L23/538; H01L25/065; H01L25/07; H01L25/16; H01L25/18; H01R9/00; H01R12/16; H01R12/71; H01R13/05; H01R13/24; H01R29/00; H01R33/74; H01R33/76; H05H1/18; H05K1/18; H05K3/24; H05K3/30; H05K3/32; H05K3/40; H05K7/10; C25D5/08; C25D5/22; C25D21/02; H01R107/00; H05K1/14; H05K3/20; H05K3/34; H05K3/36; (IPC1-7): H01L23/32
Other References:
【文献】米国特許3842189(US,A)
【文献】米国特許4732313(US,A)
【文献】米国特許4732313(US,A)
Attorney, Agent or Firm:
Kaoru Furuya (2 outside)