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Patent Searching and Data


Title:
COMMUNICATION SUBSTRATE MOUNTING DEVICE FOR IC CARD PROCESSOR
Document Type and Number:
Japanese Patent JP2009043285
Kind Code:
A
Abstract:

To provide an IC card processor changeable easily to an IC card processor for a contact type IC card or a noncontact type IC card, and capable of mounting a different noncontact type IC card or a communication substrate of a different maker, and an IC card recovery device.

This communication substrate mounting device 16 is provided with the first base 64, in the IC card processor with the communication substrate mounting device 16 communicable with the IC card arranged along a conveying route of the IC card; the first base 64 is arranged with a mounting device 11 of the communication substrate, and the mounting device can selectively mount the second base 66 having a contact type communication substrate 158 of the contact type IC card, or a communication substrate mounting part 119 of the noncontact type IC card.


Inventors:
Abe, Hiroshi
Enomoto, Minoru
Application Number:
JP2008000268031
Publication Date:
February 26, 2009
Filing Date:
October 17, 2008
Export Citation:
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Assignee:
ASAHI SEIKO KK
International Classes:
G06K17/00; G06K13/06