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Patent Searching and Data


Title:
COMPACT HOT AIR MANIFOLD FOR APPLYING ADHESIVE
Document Type and Number:
Japanese Patent JP2003245590
Kind Code:
A
Abstract:

To provide a compact hot air manifold for heating process air used for distributing a hot liquid (e.g.; hot-melt adhesive) and reduced in a dimension.

The hot air manifold is equipped with at least one heating element and an air plenum having an air inlet and an air outlet. The dimension of the air plenum is optimized in order to provide the compact hot air manifold used in a distribution system for various adhesives while keeping a capacity for heating process air in the air plenum to a desired coating temperature. The hot air manifold can be equipped with the thick film flat heater arranged in the air plenum. The air plenum can have a large number of individual segments for bending the interior of the hot air manifold as a whole. The compact hot air manifold is provided.


Inventors:
Saidman, Laurence B.
Reece, Daryl
Application Number:
JP2003000018413
Publication Date:
September 02, 2003
Filing Date:
January 28, 2003
Export Citation:
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Assignee:
NORDSON CORP
International Classes:
B67D7/80; B05C5/00; B05C5/04; B05C9/14; B05C11/10; B67D7/80; B05C5/00; B05C5/04; B05C9/14; B05C11/10; (IPC1-7): B05C11/10; B05C5/00; B05C9/14