Title:
設計データおよび欠陥データを使用したスキャナ性能の比較およびマッチング
Document Type and Number:
Japanese Patent JP5719843
Kind Code:
B2
Abstract:
A system and method of matching multiple scanners using design and defect data are described. A golden wafer is processed using a golden tool. A second wafer is processed using a second tool. Both tools provide focus/exposure modulation. Wafer-level spatial signatures of critical structures for both wafers can be compared to evaluate the behavior of the scanners. Critical structures can be identified by binning defects on the golden wafer having similar patterns. In one embodiment, the signatures must match within a certain percentage or the second tool is characterized as a "no match". Reticles can be compared in a similar manner, wherein the golden and second wafers are processed using a golden reticle and a second reticle, respectively.
Inventors:
Park Allen
Chan Ellis
Aoki
Young Chris Chi-Chen
Purihal Martin
Van Riet Michael John
Chan Ellis
Aoki
Young Chris Chi-Chen
Purihal Martin
Van Riet Michael John
Application Number:
JP2012520698A
Publication Date:
May 20, 2015
Filing Date:
July 12, 2010
Export Citation:
Assignee:
KLA-TENCOR CORPORATION
International Classes:
H01L21/027; G03F7/20; H01L21/66
Domestic Patent References:
| JP2007142275A | ||||
| JP2004079586A | ||||
| JP2002190443A | ||||
| JP2009516832A | ||||
| JP2005518107A | ||||
| JP2002124447A | ||||
| JP2008047598A | ||||
| JP2007184364A | ||||
| JP2003100599A | ||||
| JP2008543113A |
Foreign References:
| US20060155410 | ||||
| US20090030632 | ||||
| US20090105853 | ||||
| US20020065616 | ||||
| US8038897 |
Attorney, Agent or Firm:
Meisei International Patent Office