To provide a thermosetting resin composition excellent all in Tg, low thermal expansion, copper foil adhesivity, heat resistance, moisture resistance, flame retardancy, heat resistance with copper, low dielectric property, low dielectric loss tangent and alkaline liquid resistance, and use of the same, and a prepreg, a laminated plate and the like using the same.
A thermosetting resin composition contains: a compatibilization resin obtained by reacting a compound (A) which is obtained by etherifying a siloxane resin (a) having phenolic hydroxyl groups on terminals thereof and a compound (b) having at least two epoxy groups in one molecule thereof, and which has hydroxyl groups and epoxy groups in the molecular structure with a compound (B) having at least two isocyanate groups in one molecule thereof, using an organometal salt (C) as a reaction catalyst; and a fused silica surface-treated with the compatibilization resin and an N-phenyl-3-aminopropyltrimethoxysilane compound.
TSUCHIKAWA SHINJI
IZUMI HIROYUKI
| JPH06220160A | 1994-08-09 | |||
| JPH0570756A | 1993-03-23 | |||
| JPH02175718A | 1990-07-09 | |||
| JPH03277619A | 1991-12-09 |
| WO1996028496A1 | 1996-09-19 | |||
| WO2012018126A1 | 2012-02-09 |
Kenichi Hirasawa