Title:
CORRECTION OF HEAT EXPANSION IN LITHOGRAPHY DRAWING METHOD
Document Type and Number:
Japanese Patent JP2023138912
Kind Code:
A
Abstract:
To address a local heating of and a deformation caused by heating of a target during a drawing processing in an electric charge particle lithography device.SOLUTION: A pattern drawing method contains steps of: determining an exposure position where a beam is entered into a substrate and a power of the beam at the exposure position; calculating a heat diffusion and a radiation cooling in a plurality of portions over a front surface of the substrate by calculating a heating of the substrate at the exposure position; calculating a position deviation of the substrate as a result of the heat expansion in a portion on the substrate which is the same number, or the declined number; and drawing a structure updated onto the substrate by the beam by determining a deviation distance for compensating a position deviation at the exposure position, and updating a structure which as to be drawn by shifting the exposure position of the beam by the deviation distance. Those steps are repeated as a function of the exposure position of which a time and/or a beam substrate position are/is changed.SELECTED DRAWING: Figure 7
Inventors:
MATTHIAS LIERTZER
CHRISTOPH SPENGLER
WOLF NAETAR
PLATZGUMMER ELMAR
CHRISTOPH SPENGLER
WOLF NAETAR
PLATZGUMMER ELMAR
Application Number:
JP2023036671A
Publication Date:
October 03, 2023
Filing Date:
March 09, 2023
Export Citation:
Assignee:
IMS NANOFABRICATION GMBH
International Classes:
H01L21/027; G03F7/20
Attorney, Agent or Firm:
Asamichi Kato
Kiyoto Uchida
Kiyoto Uchida
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