To provide a complex environmental test method having high reproducibility, and to provide a failure detection method, a failure detection program, and a recording medium for recording the failure detection program capable of performing a complex environmental test having high reproducibility, and evaluating reliability highly accurately by simple measurement.

The complex environmental test method for evaluating reliability to cracks on a soldering part of an electronic component mounting substrate includes step S1 for performing a temperature cycle test to the electronic component mounting substrate until an initial crack is generated on the soldering part, and step S2 for performing a vibration test to the electronic component mounting substrate subjected to the temperature cycle test.