COMPLIANT BIOCOMPATIBLE PACKAGING SCHEME BASED ON NiTi SHAPE MEMORY ALLOYS FOR IMPLANTABLE BIOMEDICAL MICROSYSTEMS

Title:

COMPLIANT BIOCOMPATIBLE PACKAGING SCHEME BASED ON NiTi SHAPE MEMORY ALLOYS FOR IMPLANTABLE BIOMEDICAL MICROSYSTEMS

Document Type and Number:

Japanese Patent JP2007152117

Kind Code:

A

Abstract:

To provide a long time persistent, flexible, strong, biocompatible, tough, deformable, and implantable packaging scheme (i.e. coating).

A compliant biocompatible packaging scheme, (i.e., coating) for implantable medical device, particularly implantable biomedical microsystems 10 is provided. In accordance with the present invention, the compliant biocompatible coating includes an optional dielectric undercoating 12 and an overcoat 14 including a NiTi shape memory alloy.

Inventors:

KRULEVITCH PETER

Application Number:

JP2006328512A

Publication Date:

June 21, 2007

Filing Date:

December 05, 2006

Export Citation:

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Assignee:

NITINOL DEV CORP

International Classes:

A61N1/36

Attorney, Agent or Firm:

Hiroaki Tazawa
Konobu Kato
Hideaki Tazawa
Hamada Hatsune

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