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Title:
COMPONENT INSPECTING METHOD AND ELECTRONIC COMPONENT MOUNTING APPARATUS THEREOF
Document Type and Number:
Japanese Patent JPH11340699
Kind Code:
A
Abstract:

To provide a component inspecting method and electronic component mounting apparatus, whereby multifarrous electronic components can be inspected.

Distance data on the main body of a component and a plurality of protrusions and component inspecting parts are measured, the measured distance data are divided into specified sections, the distance data of a min. value in the section is extracted, all the distance data in the sections are converted in distance data of the min. value. A separation threshold for separating the main body and protrusions is prepared using the distance data of the min. value, and they are separated into distance data of the protrusions and distance data of others using the separation threshold and the distance data of the plurality of protrusion, thereby inspecting a plurality of protrusions located on the component.


Inventors:
KIUCHI JUN
Application Number:
JP14806098A
Publication Date:
December 10, 1999
Filing Date:
May 28, 1998
Export Citation:
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Assignee:
SONY CORP
International Classes:
G01B11/24; H05K13/08; (IPC1-7): H05K13/08; G01B11/24
Attorney, Agent or Firm:
Oka-saki-Shintaro (1 person outside)



 
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