To provide a component measurement apparatus whose assembled chip can be quickly and securely disassembled.

This component measurement apparatus 1 has a casing 2 and a lid body 3 equipped on the tip end part of the casing 2. On the tip end part of the casing 2, an opening part 21 communicating with the inside is formed. In the inside of the casing 2, a chip holder 4 to detachably attach the chip 5 via the opening part 21 is mounted. When the lid body 3 is swung toward the closing direction to a normal open position to swing the lid body 3 from a condition the chip 5 is mounted in a mounting hole 41 of the chip holder 4 further to the opening direction, the chip 5 is pushed outside the casing 2 via the opening part 21 from the mounting hole 41 of the chip holder 4.