To provide a component mounter and a component mounting method which can simultaneously form coating films having different film thicknesses, apply a paste of proper quantity on a bump, and efficiently mount a component with good bondability.
A first component and a second component each having bumps formed on its lower surface and to be superimposed and mounted on a substrate 13 to form a stacked structure are picked up by a mounting head 16 from a component supplier 1, and the mounting head 16 holding the first component and the second component are moved up and down for a paste transfer device 5 for supplying a flux 10 to be applied to the bumps of the components by transfer in a manner of application of different two types of the film thicknesses, thereby collectively supplying the flux 10 to the bumps of the plurality of components by the transfer. In this way, the proper application quantity of the paste can be ensured and component mounting can be efficiently executed with good bondability.
COPYRIGHT: (C)2008,JPO&INPIT
HIYOSHI MASAYOSHI
| JP2003273166A | 2003-09-26 | |||
| JP2003142814A | 2003-05-16 | |||
| JP2005026648A | 2005-01-27 |
Hiroki Naito
Daisuke Nagano
Next Patent: PASTE TRANSFER APPARATUS