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Title:
Component mounting apparatus
Document Type and Number:
Japanese Patent JP6051409
Kind Code:
B2
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Inventors:
Yasuhiro Okada
Chihiro Igarashi
Toshihiko Tsujikawa
Application Number:
JP2013196430A
Publication Date:
December 27, 2016
Filing Date:
September 24, 2013
Export Citation:
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Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
H05K13/04; H01L21/60
Domestic Patent References:
JP2012227194A
Attorney, Agent or Firm:
Kenji Kamada
Hiroo Maeda



 
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