Title:
Component mounting apparatus
Document Type and Number:
Japanese Patent JP6279708
Kind Code:
B2
Abstract:
A component mounting device includes a rotary head to which a plurality of suction nozzles are attached, and is able to appropriately detect occurrence of suction deviation in a component during suction by the suction nozzle caused by movement of the suction nozzle due to rotation of a rotary head, since the component mounting device determines suction deviation (posture change) of the component from after suction of the component until prior to mounting of the component (S190) based on an immediately post-suction image which is acquired by imaging the suction nozzle from the side immediately after suction of the component (S130) and an immediately pre-mounting image that is acquired by imaging the suction nozzle from the side immediately prior to mounting of the component (S180).
Inventors:
Kawai Hidetoshi
Application Number:
JP2016504894A
Publication Date:
February 14, 2018
Filing Date:
February 25, 2014
Export Citation:
Assignee:
Fuji Machine Manufacturing Co., Ltd.
International Classes:
H05K13/04; H05K13/08
Domestic Patent References:
| JP2002204096A | ||||
| JP2008311476A |
Foreign References:
| WO2009066592A1 |
Attorney, Agent or Firm:
Aitec International Patent Office
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