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Patent Searching and Data


Title:
COMPONENT MOUNTING APPARATUS
Document Type and Number:
Japanese Patent JPH05267895
Kind Code:
A
Abstract:

PURPOSE: To improve the accuracy of mounting of components by interposing a resilient member between a nozzle member and a displacement member in a component mounting apparatus equipped with a nozzle member for the attachment and removal of a component and a displacement member for axially displacing this nozzle member via a raised member.

CONSTITUTION: Air is supplied to a supply port 22, so that a piston rod 45 of a cylinder 3 and a displacement member 13 are lowered. This causes the displacement member 13 to come into contact with one end of a lever 12, whereby the lever 12 starts to open. When a spring 42 and a spline spring 53 are balanced with each other, a nozzle member 43 starts to lower, and this causes a component 29 sucked by a nozzle 18 to be attached to a substrate positioned below. At this time, when the component is pressed against the substrate, the resilient force of the spring 42 act on the displacement member 13 and the nozzle member 43 via the spring 42. This alleviates an impact produced when the displacement member 13 and a nozzle member 19 come into collision with each other, whereby the component is correctly attached to a normal position.


Inventors:
Hiroyuki Funaki
Application Number:
JP9362792A
Publication Date:
October 15, 1993
Filing Date:
March 19, 1992
Export Citation:
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Assignee:
Tokiko Corporation
International Classes:
B23P21/00; B25J15/06; H05K13/04; (IPC1-7): H05K13/04; B23P21/00; B25J15/06
Attorney, Agent or Firm:
Nobuo Kaida (2 outside)