Title:
COMPONENT MOUNTING BOARD FOR MEMORY DEVICE
Document Type and Number:
Japanese Patent JP2550477
Kind Code:
B2
Abstract:
PURPOSE: To obtain a component mounting board whose thickness is reduced in a state that an electronic component has been mounted or in which a memory capacity can be changed easily.
CONSTITUTION: A base-body board 13 is constituted in such a way that a board 1 and a board 2 which are composed of a resin are bonded. Holes 3 for housing of memory electronic components are made in the base-body board 13. Input/ output terminals 4 are installed on the base-body board 13. Terminals 5 for driving electronic components are installed on the base-body board 13. Terminals for the memory electronic components are installed in the holes 3 for housing of the memory electronic components. Interconnections are formed on the base- body board 13. Through holes are made in the base-body board 13. The input/ output terminals 4, the terminals 5 for the driving electronic components and the terminals for the memory electronic components are connected by the interconnections and the through holes.
Inventors:
OZAKI YOSUKE
Application Number:
JP11481494A
Publication Date:
November 06, 1996
Filing Date:
May 27, 1994
Export Citation:
Assignee:
OO KEE PURINTO KK
International Classes:
H05K1/18; H05K1/02; H05K1/14; (IPC1-7): H05K1/18; H05K1/02
Domestic Patent References:
| JP1097581B | ||||
| JP62184775B | ||||
| JPS6245870B2 |
Attorney, Agent or Firm:
Junnosuke Nakamura
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