Title:
COMPONENT MOUNTING CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2023124034
Kind Code:
A
Abstract:
To provide a component mounting circuit board of a structure with which it is possible to more reliably detect that the component mounting circuit board is immersed in a liquid.SOLUTION: A component mounting circuit board 100 includes a sheet-like wet detection sensor unit 90, the wet detection sensor unit 90 comprising a circuit board 10 that includes a substrate 11, a first conductive pattern 30 formed on the substrate 11, and a mounted component 50 which is electrically connected to the first conductive pattern 30, and a second conductive pattern 40 complementarily constituting a circuit 60 with the first conductive pattern 30. A region of the substrate 11 corresponding to the second conductive pattern 40 is a missing part 12 that is missing, and further includes a water absorbing expander 70. When the water absorbing expander 70 expands upon absorbing water, the water absorbing expander 70 pushes the substrate 11 or the second conductive pattern 40 in a direction perpendicular to the surface of the substrate 11, causing the second conductive pattern 40 to break.SELECTED DRAWING: Figure 8
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Inventors:
TOMINAGA AZUMI
Application Number:
JP2022027579A
Publication Date:
September 06, 2023
Filing Date:
February 25, 2022
Export Citation:
Assignee:
NIPPON MEKTRON KK
International Classes:
G01N27/00; G01N27/06
Attorney, Agent or Firm:
Shunsuke Migita