Title:
COMPONENT MOUNTING DEVICE AND ADJUSTING METHOD FOR THE SAME
Document Type and Number:
Japanese Patent JP2016189377
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a component mounting device capable of easily performing an adjustment work of a component crimping part, and an adjustment method for the same.SOLUTION: In a component mounting device 1 including a mounting stage 35 for holding a substrate 2 on which a component 3 is mounted, a mounting stage moving mechanism 35M for moving the mounting stage 35 to position the substrate 2 held on the mounting stage 35 to a predetermined component crimping position, and a component crimping portion 33 for crimping the component 3 to the substrate 2 positioned at the component crimping position by the mounting stage moving mechanism 35 M, the mounting stage moving mechanism 35M moves the mounting stage 35 in a direction to make the mounting stage 35 be away from the component crimping portion 33 when an adjustment working mode setting operation unit 101 to be operated when adjusting the component crimping portion 33 is operated.SELECTED DRAWING: Figure 13
Inventors:
UCHIYAMA HIROSHI
TSUJISAWA TAKAFUMI
MIYAZAKI HIROKUNI
HAMADA RYUJI
OKADA YASUHIRO
MATSUO NOBUYA
TSUJISAWA TAKAFUMI
MIYAZAKI HIROKUNI
HAMADA RYUJI
OKADA YASUHIRO
MATSUO NOBUYA
Application Number:
JP2015068173A
Publication Date:
November 04, 2016
Filing Date:
March 30, 2015
Export Citation:
Assignee:
PANASONIC IP MAN CORP
International Classes:
H05K13/04; H01L21/60; H01L21/677; H05K3/32; H05K13/08
Attorney, Agent or Firm:
Kenji Kamada
Hiroo Maeda
Hiroo Maeda