Title:
COMPONENT MOUNTING DEVICE
Document Type and Number:
Japanese Patent JPH05321914
Kind Code:
A
Abstract:
PURPOSE: To mount components without deflecting the components under high temperature and low temperature conditions when mounting a variety of components in packaging electric components.
CONSTITUTION: Attaching screws 12 for mounting and fixing a substrate 9 and a heat sink 10 are made be form variable spring-like screws. By this constitution, the attaching screws 12 damp the expansion and shrinkage of the substrate 9 and the heat sink 10, preventing the substrate 9 from deflecting.
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Inventors:
FUJIKAWA KAZUHIKO
Application Number:
JP12595492A
Publication Date:
December 07, 1993
Filing Date:
May 19, 1992
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
F16B5/02; F16B35/00; H05K7/12; (IPC1-7): F16B5/02; H05K7/12
Attorney, Agent or Firm:
Akira Kobiji (2 outside)
Previous Patent: JPS5321913
Next Patent: FITTING HOLE AND SPRING STRUCTURE OF COMBINATION MEMBER AND HOLE MAKING TOOL
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