部品実装方法および部品実装基板の製造方法

Title:

部品実装方法および部品実装基板の製造方法

Document Type and Number:

Japanese Patent JP7022888

Kind Code:

B2

Abstract:

There is provided a component mounting method for mounting an electronic component provided with a connecting pin on a board having a through-hole, including inserting the pin of the electronic component into an inner hole filled with solder paste at a first electrode provided in the through-hole to execute a component mounting operation of lowering the pin to a predetermined mounting height position and pulling up the pin once inserted and lowered into the inner hole in the component mounting operation to a preset intermediate height position.

Inventors:

Tetsuya Tanaka
Katsuhiko Akasaka
Koji Sakurai
Toshihiko Nagaji

Application Number:

JP2017178542A

Publication Date:

February 21, 2022

Filing Date:

September 19, 2017

Export Citation:

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