Title:
部品実装方法及び装置
Document Type and Number:
Japanese Patent JP4128156
Kind Code:
B2
Abstract:
Reference marks arranged at specified intervals on a glass board are recognized, and from its recognition results, offset values for individual areas matching the board size are determined as numerical values for correction use, and further corresponding offset values for individual movement positions of a component placing head are reflected as numerical values for correction use in operation of placing position correction, mark recognition correction, or measurement of placing position offset values, respectively. Thus, high-accuracy placing is achieved. Moreover, correction of positional displacement of a component holding member due to an inclination of the component placing head is performed.
Inventors:
Osamu Okuda
Takeyuki Kawase
Kazuyuki Yoshitomi
Takeyuki Kawase
Kazuyuki Yoshitomi
Application Number:
JP2004165976A
Publication Date:
July 30, 2008
Filing Date:
June 03, 2004
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H05K13/04; H05K13/08
Domestic Patent References:
| JP11274799A | ||||
| JP10209688A |
Attorney, Agent or Firm:
Takuji Yamada
Mitsuo Tanaka
Hiroshi Okabe
Mitsuo Wada
Mitsuo Tanaka
Hiroshi Okabe
Mitsuo Wada
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