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Title:
COMPONENT MOUNTING STRUCTURE ON MOLDED ARTICLE
Document Type and Number:
Japanese Patent JP2007007273
Kind Code:
A
Abstract:

To provide a component mounting structure on a molded article capable of preventing the compressive deformation of a portion of a molded article having a soft intermediate resin layer composed of resin foam fastened by a mounting component and having superior external appearance and waterproofing property.

The molded article 1 is formed with the intermediate resin layer 5 composed of resin foam between a surface resin layer 3 and a back resin layer 4. The back face of the molded article 1 is formed with a recess 6 having the bottom reaching the surface resin layer 3. A hard body 8 harder than the intermediate resin layer 5 is embedded in the recess 6 and fixed to and integrated with the molded article 1. The molded article 1 is formed with a through-hole 10 penetrating through the hard body 8 and the surface resin layer 3. The mounting component 2 is inserted into the through-hole 10. The circumferential edge part of the through-hole is clamped by the mounting component 2 from the both front/rear sides of the molded article 1 to mount the mounting component 2 on the molded article 1.


Inventors:
ISHIKURA KENTARO
MATSUMURA KOICHI
KOJIMA HIROSHI
KOBAYAKAWA MASUNORI
IBI HIDEMI
Application Number:
JP2005194165A
Publication Date:
January 18, 2007
Filing Date:
July 01, 2005
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
A47K3/02; A47K3/00
Domestic Patent References:
JPS6292784U1987-06-13
JPH09182681A1997-07-15
Attorney, Agent or Firm:
Keisei Nishikawa
Atsuo Mori



 
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