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Patent Searching and Data


Title:
COMPONENT MOUNTING SUBSTRATE, ELECTRONIC CIRCUIT DEVICE, AND NON-RECIPROCAL CIRCUIT ELEMENT, AND COMMUNICATION DEVICE
Document Type and Number:
Japanese Patent JP2008053842
Kind Code:
A
Abstract:

To provide a component mounting substrate that reduces size, thickness, and costs effectively and has a structure that can be manufactured with stable characteristics and a high yield, and to provide a non-reciprocal circuit element and a communication device having the non-reciprocal circuit element.

The component mounting substrate has a conductive substrate 10 and an insulating film 11. The insulating film 11 has ground electrodes 110-116 for exposing the surface of the conductive substrate 10 on at least one surface of the conductive substrate 10, and covers the entire surface of the conductive substrate 10 except the ground electrodes 110-116. The conductive substrate 10 has a recess 100 within the surface. Terminals 117, 118 are buried inside the recess 100. The terminals 117, 118 are electrically insulated from the conductive substrate 10 by the insulating film 11 adhering onto the inner-wall surface of the recess 100.


Inventors:
KINOSHITA TAKESHI
SAKAI MINORU
Application Number:
JP2006225694A
Publication Date:
March 06, 2008
Filing Date:
August 22, 2006
Export Citation:
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Assignee:
TDK CORP
International Classes:
H01P1/32; H01P11/00
Attorney, Agent or Firm:
Mijiro Abe
Yoshikazu Takei