Title:
COMPONENT POLISHING METHOD, COMPONENTS, AND PLASTIC FOR POLISHING
Document Type and Number:
Japanese Patent JP2008229757
Kind Code:
A
Abstract:
To provide a technique for more flattening desired portions of components mainly made of cemented carbide to be used for a tool material and a mold material.
In this component 10 polishing method, polishing is performed by using plastic selected from a group constituted of polybenzimidazoles, polycarbonates, polysulfones, polyethersulfones, polyarylates, polyamide-imides, polyetherimides, polyphenylene sulfides, polyetheretherketones, polyimides and polytetrafluoroethylenes, and the mixtures including copolymer.
Inventors:
Kato, Hideji
Shintani, Kazuhiro
Shintani, Kazuhiro
Application Number:
JP2007000070865
Publication Date:
October 02, 2008
Filing Date:
March 19, 2007
Export Citation:
Assignee:
KANAZAWA INST OF TECHNOLOGY
International Classes:
B24B3/06; B24D99/00
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