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Title:
COMPONENTS WITH COOLING CHANNELS AND MANUFACTURING METHODS
Document Type and Number:
Japanese Patent JP2014088872
Kind Code:
A
Abstract:

To provide manufacturing methods for forming cooling channels provided with openings reduced in size.

A manufacturing method includes forming one or more grooves 132 in a component that comprises a substrate 110 with an outer surface 112. The substrate 110 has at least an interior space 114. Each groove 132 extends at least partially along the substrate 110 and has a base 110 and a top. The manufacturing method further includes applying a structural coating 54 on at least a portion of the substrate 110 and processing at least a portion of the surface of the structural coating 54 so as to plastically deform the structural coating 54 at least in the vicinity of the top of each groove 132, such that a gap 144 across the top 146 of the groove 132 is reduced. A component is also disclosed and includes a structural coating 54 disposed on at least a portion of a substrate 110, where the surface of the structural coating 54 is faceted in the vicinity of each groove 132.


Inventors:
BUNKER RONALD SCOTT
WEAVER SCOTT ANDREW
LIPKIN DON MARK
JOHN BRIAN MCDERMOTT
Application Number:
JP2013172766A
Publication Date:
May 15, 2014
Filing Date:
August 23, 2013
Export Citation:
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Assignee:
GEN ELECTRIC
International Classes:
F02C7/00; B23H9/10; B23K26/36; C21D7/06; F01D5/18; F01D9/02; F01D25/00; F01D25/12; F02C7/18; F02C7/24; C22C27/02
Domestic Patent References:
JP2012136776A2012-07-19
JP2012127343A2012-07-05
JP2012102732A2012-05-31
JPS5985989A1984-05-18
JPS57200895A1982-12-09
JP2008174838A2008-07-31
JP2008150702A2008-07-03
JP2006069706A2006-03-16
Attorney, Agent or Firm:
Arakawa Satoshi
Hirokazu Ogura
Toshihisa Kurokawa
Takuto Tanaka



 
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