Title:
熱排出が改善された構成素子
Document Type and Number:
Japanese Patent JP7000308
Kind Code:
B2
Abstract:
In a component with component structures generating dissipation heat, it is proposed to apply on an active side of the substrate a heat-conducting means to the back side of the component substrate, which has a second thermal conductivity coefficient αLS, which is substantially higher than the first thermal conductivity coefficient αS of the substrate. The heat dissipation then succeeds via the heat-conducting means and via connecting means which connect the substrate to a carrier.
Inventors:
Yebwa, Tomash
Meister, Fight
Meister, Fight
Application Number:
JP2018500891A
Publication Date:
January 19, 2022
Filing Date:
June 15, 2016
Export Citation:
Assignee:
EPCOS AG
International Classes:
H01L23/02; H03H9/25; H01L23/36
Domestic Patent References:
| JP2003347488A | ||||
| JP2005223580A | ||||
| JP2013131711A | ||||
| JP2005217670A | ||||
| JP2005325348A | ||||
| JP2013066042A |
Attorney, Agent or Firm:
Masatoshi Kurata
Moriso Iseki
Takashi Okada
Moriso Iseki
Takashi Okada