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Title:
COMPOSITE ABRASIVE GRAIN AND POLISHING COMPOSITION USING THE SAME
Document Type and Number:
Japanese Patent JP2012121128
Kind Code:
A
Abstract:

To provide a method for producing a composite abrasive grain which enables highly accurate and efficient polishing at a low cost.

The composite abrasive grain comprises inorganic particles and organic particles each having an aspheric body including a concave part with a concave surface with respect to a spherical surface and a streak part surrounding the concave part, wherein the inorganic particles adhere to the surfaces of the organic particles. For example, the inorganic particles are ceria particles. The organic particles are composite polymer particles of polyurethane and polymethyl methacrylate. When the composite abrasive grain is used, high-rate polishing can be performed while securing surface roughness which is the same as that obtained when an abrasive grain made of only the ceria particles are used. The composite abrasive grain uses less amount of ceria particles and the like containing rare earth metals, thereby achieving cost reduction and stable supply of an abrasive grain and polishing slurry and the like.


Inventors:
YAMADA MIYUKI
YANAGIHARA TAKESHI
TANI YASUHIRO
Application Number:
JP2010276367A
Publication Date:
June 28, 2012
Filing Date:
December 10, 2010
Export Citation:
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Assignee:
ADMATECHS CO LTD
RITSUMEIKAN
International Classes:
B24B37/00; C09K3/14
Domestic Patent References:
JP2001300843A2001-10-30
JP2003336038A2003-11-28
JP2004075827A2004-03-11
Attorney, Agent or Firm:
Morioka Masayuki