Title:
COMPOSITE ARTICLE
Document Type and Number:
Japanese Patent JPS59145552
Kind Code:
A
Abstract:
Copper alloys are disclosed which may be bonded to aluminum containing members wih reduced formation of undesirable copper-aluminum intermetallic compounds. The copper alloys consist essentially of about 15% to about 30% nickel and the balance essentially copper and have particular utility in integrated circuit assemblies as lead frames (18), lead wires (20) and beam lead tapes (26). The nickel addition in the alloys suppresses the nucleation rate and the subsequent growth rate of copper-aluminum intermetallic compounds.
Inventors:
JIYON EFU BURIIDEISU
JIYURIUSU SHII FUISUTAA
JIYURIUSU SHII FUISUTAA
Application Number:
JP465484A
Publication Date:
August 21, 1984
Filing Date:
January 13, 1984
Export Citation:
Assignee:
OLIN MATHIESON
International Classes:
C22C9/00; B23K35/00; C22C9/06; C23C2/12; H01L21/60; H01L23/49; H01L23/495; H01L23/50; (IPC1-7): C22C9/06; C23C1/08; C25D3/44; H01L21/60; H01L23/48; H01L29/40
Attorney, Agent or Firm:
Asamura Akira