Title:
COMPOSITE BOARD
Document Type and Number:
Japanese Patent JP2001079973
Kind Code:
A
Abstract:
To prevent a warpage and a crack from being generated even in an environment wherein a large temperature difference is present in a composite board made by laminating a thermal insulating material comprising foamed material on a ceramic based board material.
One side face of a thermal insulating board 1 comprising a foamed material is taken as a laminating face, and after a cut 4 is formed on the laminating face, a ceramic based cladding board 6 is laminated via an adhesive 5. Even in an environment having a large temperature difference, since shrinkage and expansion of the heat insulating board having a large dimensional change ratio are absorbed in the cut, a warpage and a crack are not generated.
Inventors:
SUGAWARA KIMIO
Application Number:
JP25654699A
Publication Date:
March 27, 2001
Filing Date:
September 10, 1999
Export Citation:
Assignee:
SUGAWARA KIMIO
International Classes:
E04B1/80; B32B5/18; B32B13/12; E04C2/04; E04F13/14; (IPC1-7): B32B5/18; B32B13/12; E04B1/80; E04F13/14
Attorney, Agent or Firm:
Ichiro Doi