Title:
WOOD/PLASTIC COMPOSITE BOARD
Document Type and Number:
Japanese Patent JP2018094861
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a wood/plastic composite board which can be molded and achieves various characteristics used for practical use.SOLUTION: A wood/plastic composite board 1 contains a core layer 2 formed by blending wood flour with a thermosetting resin and a glass mat layer 3 formed by impregnating a mat-like object of a glass fiber with a thermosetting resin, where a filling rate defined by expression (1) of the wood flour in the core layer is in a range of 50-90%, and the glass mat layer is mounted and laminated on both front and rear faces of the core layer to be integrated into a wood/plastic composite board. Expression (1): (filling ratio (%))=(total mass (kg) of wood flour in core layer)/(total mass (kg) of core layer)×100.SELECTED DRAWING: Figure 1
Inventors:
ISHII MASA
NAKAGAWA MASAHIRO
NAITO SHIGEKI
HAYASHI SHIN
NAKAGAWA MASAHIRO
NAITO SHIGEKI
HAYASHI SHIN
Application Number:
JP2016244112A
Publication Date:
June 21, 2018
Filing Date:
December 16, 2016
Export Citation:
Assignee:
PANASONIC IP MAN CORP
International Classes:
B32B17/10; B32B15/14; B32B15/20; B32B17/04; B32B27/20; B32B27/42; C08J5/24
Attorney, Agent or Firm:
Patent business corporation Hokuto patent office
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