Title:
COMPOSITE CHIP COMPONENT, CIRCUIT ASSEMBLY, AND ELECTRONIC APPARATUS
Document Type and Number:
Japanese Patent JP2019153802
Kind Code:
A
Abstract:
To provide a composite chip component capable of reducing a bond area (footprint) for a mounting substrate and therefore, capable of achieving efficiency of mounting operation.SOLUTION: A composite chip component of the present invention includes: a plurality of chip elements which are disposed so as to be mutually spaced apart upon a common semiconductor substrate, and which have mutually different functions; an insulating film covering the chip elements; a pair of electrodes 3 and 4 electrically connected to each chip element; and a resin film 24 formed on the insulating film. Each of the electrodes includes: a drawing portion which is drawn in a lateral direction along the surface of the resin film and which selectively covers the surface; and peripheral edge portions 85, 86 and 87 which are formed to straddle the surface and the side surface of the semiconductor substrate so as to cover an edge portion of the semiconductor substrate. The insulating film insulates between the semiconductor substrate and the electrode on a side surface of the semiconductor substrate.SELECTED DRAWING: Figure 1A
Inventors:
TAMAGAWA HIROSHI
NIINO KOICHI
NUKAGA EIJI
WATANABE KEISHI
NIINO KOICHI
NUKAGA EIJI
WATANABE KEISHI
Application Number:
JP2019082215A
Publication Date:
September 12, 2019
Filing Date:
April 23, 2019
Export Citation:
Assignee:
ROHM CO LTD
International Classes:
H01G4/40; H01C13/00; H01G2/16; H01G4/38
Domestic Patent References:
| JP2011238730A | 2011-11-24 | |||
| JP2002075702A | 2002-03-15 | |||
| JP2008270447A | 2008-11-06 | |||
| JPS61230301A | 1986-10-14 | |||
| JP2012004180A | 2012-01-05 | |||
| JPH10135016A | 1998-05-22 |
Foreign References:
| WO2006085492A1 | 2006-08-17 |
Attorney, Agent or Firm:
Patent Business Corporation Ai Patent Office