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Title:
COMPOSITE CONDUCTIVE TYPE MOLDED ARTICLE
Document Type and Number:
Japanese Patent JPS58166028
Kind Code:
A
Abstract:

PURPOSE: To keep strength suitable to an product and prevent the product from generating warpage by a method wherein a conductive molded piece with a large projected area and a small thickness is divided into a molded portion requiring conductive function and a base supporting said molded portion.

CONSTITUTION: A hole having a suitable shape and size (l1≥l2, l1/d≤75) is bored on a base plate 1 having a large projected area, a small thickness and a dimension ratio l>d>75 and a conductive molded piece having a suitable shape and size is provided on this hole portion. An insulating or conductive broad of thermosetting resin, thermoplastic resin, rubber or metal is used for the base 1 while powdery or fibrous material such as graphite, carbon black, etc. as conductive filler is used for conductive filler dispersion molding material, while thermosetting resin, thermo-plastic resin or rubber are used for resin component.


Inventors:
OIKAWA YASUO
Application Number:
JP4936082A
Publication Date:
October 01, 1983
Filing Date:
March 26, 1982
Export Citation:
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Assignee:
FUJI DENKI SOGO KENKYUSHO KK
International Classes:
B29D99/00; B29C61/00; B29C67/00; B32B7/02; (IPC1-7): B29D31/00; B32B7/02
Attorney, Agent or Firm:
Someya Hitoshi



 
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