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Title:
COMPOSITE COPPER-CARBON FIBER MATERIAL FOR LEAD WIRE
Document Type and Number:
Japanese Patent JPS57161041
Kind Code:
A
Abstract:

PURPOSE: To manufacture a composite copper-carbon fiber material with superior bendability for a lead wire suitable for the connection of a silicon element, etc. by reducing the precentage of carbon fiber only at each part to be bent.

CONSTITUTION: In a composite copper-carbon fiber body (composite Cu-C body) 6 composed of warp 7 of copper plated carbon fiber with high electric anc heat conductivities along the longitudinal direction and of woof 8 of such fiber intersecting the warp 7, the percentage of the carbon fiber is regulated to about 50vol% to make the composite Cu-C body 6 almost equal to a silicon element in coefft. of thermal expansion, and a lead wire suitable for the connection of the silicon element, etc. is obtd. By reducing the percentage of the carbon fiber at each part to be bent to about 25W0vol% with thin copper wires 9 as only the woof 8 or both the warp 7 and woof 8, the bendability is increased. The composite Cu-C body 6 having partially copper packed layers 11 is coated with a copper layer 10, press-sintered, and cut suitably to obtain a lead wire.


Inventors:
YASUDA TOMIROU
NEMOTO TADASHI
KADOSE MASUO
SEKIJIMA TOKUO
KUNIYA KEIICHI
Application Number:
JP4646781A
Publication Date:
October 04, 1982
Filing Date:
March 31, 1981
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
C22C49/00; B32B15/14; C22C9/00; H01L21/52; (IPC1-7): B32B15/14; C22C1/09; C22C9/00



 
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