Title:
複合銅粒子、銅インク、および、複合銅粒子の製造方法
Document Type and Number:
Japanese Patent JP6922648
Kind Code:
B2
Abstract:
To provide a composite copper particle capable of forming a copper conductive film having a low sheet resistivity in the case where it is contained in a copper ink.SOLUTION: A composite copper particle comprises a copper-base particle and a copper fine particle that is coated over a surface of the copper-base particle and smaller in particle size than the copper-base particle. The copper-base particle is coordinated with a lower carboxylic acid having a carbon number of 1 or greater and 3 or smaller onto at least one part of a surface, so that the copper fine particle is coated over the copper-base particle through the lower carboxylic acid. The lower carboxylic acid is excellent in pyrolytic property.SELECTED DRAWING: Figure 1
Inventors:
Takamitsu Demura
Sakata Shun
Sakata Shun
Application Number:
JP2017206688A
Publication Date:
August 18, 2021
Filing Date:
October 25, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
B22F1/00; B22F1/02; B22F9/24; H01B1/22
Domestic Patent References:
| JP2010285678A | ||||
| JP2013159830A |
Foreign References:
| WO2018190246A1 |
Attorney, Agent or Firm:
Nao Kawamoto