To provide a composite dielectric powder forming slurry to suppress the gelation even if the raw material being fine powder and giving a high strength low temperature fired ceramic, and a method of manufacturing the same, a sheet-like powder formed body, and a method of manufacturing a ceramic circuit board.

The composite dielectric powder is formed by integrally covering the surface of a dielectric ceramic particle with a glass layer and the average particle diameter of the dielectric ceramic particle is preferably ≤3 μm. The method of manufacturing the composite dielectric powder possesses a process for preparing the dielectric ceramic particle, a process for melting glass and a process for applying the molten glass on the dielectric ceramic particle to form the dense glass layer and further has a process for mixing the dielectric ceramic particle with the glass powder and a process for heating the mixture at a temperature equal to or above the softening point of the glass.