PURPOSE: To perform formation without baking by using a material having hydraulicity and a dielectric material.
CONSTITUTION: A composite dielectric is formed by using a material having hydraulicity and a dielectric material. The dielectric material is able to be dispersed in hydraulic material to undergo hydraulic hardening. Thereby, the composite dielectric having an excellent dielectric characteristic can be obtained without a baking process, and when this composite dielectric is used, formation of a laminated chip capacitor using a base metal electrode such as Cu, Ni becomes possible and since the dielectric material can be synthesized at a room temperature without baking, a baking temperature of electrode paste can be freely selected at the time of manufacturing laminated chip parts.
TAMURA HIROSHI
KONOIKE TAKEHIRO
