Title:
COMPOSITE FIBER BOARD MATERIAL
Document Type and Number:
Japanese Patent JP3171432
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a board material securing a sure fixing structure with thermal deformation reduced, by adding mica to the water-dispersion mainly comprising polyethylene fibers to suppress the forming shrinkage.
SOLUTION: A water-dispersed raw material is prepared by using 50-70wt.% of polyethylene fibers, 10-20 pts.wt. of a pulp material, 1-5 pts.wt. of a heat- resistant fibers such as polyester fibers and 5-30 pts.wt. of mica. The water- dispersed raw material in the tank 10 is fed on a running mesh conveyer 11 and accumulated, as water is-drained. The unit weight of the mat M is adjusted to 1,100-1,200-gem2 on the drum 12 through the cutter 13, drained with the press 14, dried by the drying oven 15 and cut into prescribed dimensions with the cutting blade 16 into a composite fiber board material 20.
Inventors:
Koichi Shimizu
Application Number:
JP25625696A
Publication Date:
May 28, 2001
Filing Date:
September 27, 1996
Export Citation:
Assignee:
Kasai Kogyo Co., Ltd.
International Classes:
D21J1/00; (IPC1-7): D21J1/00
Domestic Patent References:
| JP501181A | ||||
| JP58126140A |
Attorney, Agent or Firm:
Shigenori Wada