Title:
COMPOSITE FILM, AND FORMATION OF TRANSFER BUMP BY USE THEREOF
Document Type and Number:
Japanese Patent JPH05206143
Kind Code:
A
Abstract:
PURPOSE: To provide a composite film on which bumps are to be accurately and easily formed for connection of or as contacts for semiconductor devices, electric and electronic parts, and electric circuits, and a method of forming a transfer bump by the use of the said film.
CONSTITUTION: A composite film is composed of an insulating film 1, such as of polyimide resin, and it is penetrated by metal bodies 2 that are protruding beyond one or both surfaces of the film. The metal bodies are tapered toward one side of the film and removable from the film.
Inventors:
OUCHI KAZUO
TANAKA MUNEKAZU
SUGIMOTO MASAKAZU
TANAKA MUNEKAZU
SUGIMOTO MASAKAZU
Application Number:
JP8794292A
Publication Date:
August 13, 1993
Filing Date:
March 11, 1992
Export Citation:
Assignee:
NITTO DENKO CORP
International Classes:
C09J7/02; H01L21/321; H01L21/60; (IPC1-7): C09J7/02; H01L21/321; H01L21/60