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Title:
複合積層体及び、金属—変性ポリフェニレンエーテル接合体
Document Type and Number:
Japanese Patent JP6919074
Kind Code:
B2
Abstract:
The present invention addresses the problem of providing: a composite layered product suitable for applications where a metal and a modified poly(phenylene ether) are bonded to each other so as to attain high strength; and a technique related to the composite layered product. In order to achieve the aforementioned purposes, the present invention has the following means. The composite layered product comprises a metallic material and, superposed thereon, a resinous coating layer composed of one or more resin layers, wherein at least one of the resin layers is a re-modified/modified poly(phenylene ether) layer formed from a resin composition including a re-modified/modified poly(phenylene ether), the re-modified/modified poly(phenylene ether) layer being at least one layer selected from between a layer including mixture 1, which is a mixture of a modified poly(phenylene ether) and a thermoplastic epoxy resin, and a layer including mixture 2, which is a mixture of a modified poly(phenylene ether) and a (meth)acrylic resin.

Inventors:
Kazuo Otani
Shinji Numao
Application Number:
JP2020559564A
Publication Date:
August 11, 2021
Filing Date:
July 30, 2020
Export Citation:
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Assignee:
SHOWA DENKO K.K.
International Classes:
B32B15/08; B29C43/28; B29C45/14
Domestic Patent References:
JP2008155586A
JP11269428A
JP2007224162A
JP2004160991A
JP2019151106A
Foreign References:
WO2017170736A1
WO2018124215A1
Attorney, Agent or Firm:
Otani patent office