Title:
COMBINED PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2017119345
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To achieve acceleration of processing by performing laser processing and mechanical processing continuously or in parallel.SOLUTION: A combined processing process comprises: a laser processing process in which an irradiation position of laser beam at which a work-piece including at least CFRP, GFRP or GMT is processed and a processing position of a tool for processing the work-piece are moved according to a prescribed movement reference, and the work-piece is processed with laser beam; and a mechanical processing process in which a position of the work-piece processed with laser beam is processed by the tool subsequently to the laser processing process. In the laser processing process, cutting of the work-piece and boring of a hole are roughly processed with laser beam, and in the mechanical processing process, a cut surface of the work-piece and an opening edge of the hole, which are processed with laser beam, are finished.SELECTED DRAWING: Figure 9
Inventors:
KUREYA MASAYUKI
TSURUGA SHIGENORI
WATANABE TOSHIYA
NIITANI HARUHIKO
YAMASHITA TSUGUMARU
HORIE JO
ISHIDE TAKASHI
TSURUGA SHIGENORI
WATANABE TOSHIYA
NIITANI HARUHIKO
YAMASHITA TSUGUMARU
HORIE JO
ISHIDE TAKASHI
Application Number:
JP2017073921A
Publication Date:
July 06, 2017
Filing Date:
April 03, 2017
Export Citation:
Assignee:
MITSUBISHI HEAVY IND LTD
International Classes:
B23P23/04; B23K26/00; B23K26/38; B23K26/382
Domestic Patent References:
| JPS63144922A | 1988-06-17 | |||
| JPH01171709A | 1989-07-06 | |||
| JP2005303322A | 2005-10-27 | |||
| JPS5521863U | 1980-02-12 | |||
| JPS55125954A | 1980-09-29 | |||
| JPH10113815A | 1998-05-06 | |||
| JP2007196373A | 2007-08-09 | |||
| JPS61152345A | 1986-07-11 |
Foreign References:
| US20040104207A1 | 2004-06-03 |
Attorney, Agent or Firm:
Sakai International Patent Office